Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  X-ray photolithography (front-front align) (PMMA)
  1 PMMA resist sheet bonding
on front
  2 Surface fly-cutting
Materialphotoresist (category)
on front
  3 X-ray front-front align
on front
  4 X-ray exposure
MaterialPMMA
  5 Photoresist develop (PMMA)
MaterialPMMA
Process characteristics:
Resist thickness
Resist thickness*
must be 0 .. 550 µm
0 .. 550 µm
Thickness removed
Amount of material removed
 0 .. 500 µm
Wafer size
Wafer size