Process Hierarchy

on front
  Silicon nitride PECVD (PlasmaTherm 790)
Materialsilicon nitrideRefractive index2.15
Refractive index1 .. 4Thickness0.01 .. 2 µm
Process characteristics:
Perform RTA
Perform RTA*
yes no
Perform thickness metrology
Select one of the options presented here
Perform thickness metrology*
Select one of the options presented here
Thickness
Amount of material added to a wafer
Thickness*
Amount of material added to a wafer, must be 0 .. 0.5 µm
0 .. 0.5 µm
Material silicon nitride
Wafer size
Wafer size