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About MEMS
POCl3 diffusion: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Diffusion
Ion implantation
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at
engineering@mems-exchange.org
or call us at (703) 262-5368
on front
POCl3 diffusion
1
Piranha/HF clean
1.1
Piranha clean (MOS-clean)
1.2
10:1 HF dip
2
POCl3 diffusion
on front
3
Sheet resistance measurement
Batch sizes
100 mm: 24, 150 mm: 12
Excluded materials
gold
Process both sides
no
Wafer size
Wafer size
100 mm
150 mm