Process Hierarchy

on front
  Nickel LIGA (fully released structures) (PMMA)
Materialtitanium
on front
  2 Gold E-beam evaporation
Materialgold
on front
  3 Titanium DC sputtering
Materialtitanium
Depth100 nmMaterialtitanium
on front
  5.2 Surface fly-cutting
Materialphotoresist (category)
on front
  5.3 X-ray front-front align
on front
  5.4 X-ray exposure
MaterialPMMA
MaterialPMMA
MaterialSU-8
Materialnickel
MaterialPMMA
MaterialPMMA
Materialtitanium
Process characteristics:
Nickel thickness
Nickel thickness*
must be 0 .. 500 µm
0 .. 500 µm
Resist thickness
Resist thickness*
must be 0 .. 1000 µm
0 .. 1000 µm
Gold thickness 0.1 µm
Mold deviation across height 2 µm
Mold height uniformity 10 µm
Mold sidewall roughness 200 nm
Release layer thickness 3 µm
Smallest feature size 5 µm
Titanium thickness 0.01 µm
Wafer size
Wafer size
Comments:
  • This LIGA process is used to
    make Ni structures that are
    completely released from the
    handling substrate at the end
    of the process.
  • Application examples: Gear
    wheels and microsprings.
  • Pricing available upon request.
  • Process requires an X-ray
    mask. Please refer to
    'Mask-making' section.
  • Process is confined to a 2"
    diameter area.