Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
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  Parylene C deposition
  1 Ultrasonic clean
  2 Application of adhesion promoter (MEOPTS)
Material97% 3-Methacryloxypropyltriethoxyline
  3 Application of demoter
MaterialMicro-90
  4 Parylene C deposition
MaterialParylene C
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  5 Optical surface profilometry
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  6 Spectroscopic ellipsometry film thickness measurement
Refractive index1 .. 4Thickness0.01 .. 5 µm
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  7 Spectroscopic ellipsometry film thickness measurement
Refractive index1 .. 4Thickness0.01 .. 5 µm
Process characteristics:
Apply adhesion demoter
Apply adhesion demoter*
yes no
Apply adhesion promoter
Apply adhesion promoter*
yes no
Clean type
Clean type*
Perform optical surface profilometry
Perform optical surface profilometry*
yes no
Perform spectroscopic ellipsometry
Perform spectroscopic ellipsometry*
yes no
Perform stylus profilometry
Perform stylus profilometry*
yes no
Thickness
Amount of material added to a wafer
Thickness*
Amount of material added to a wafer, must be 1 .. 25 µm
1 .. 25 µm
Batch sizes 100 mm: 4, 50 mm: 6, 75 mm: 5
Material Parylene C
Sides processed both
Wafer size
Wafer size
Comments:
  • Parylene C is an inert, hydrophobic, optically clear biocompatible polymer coating material used in a wide variety of industries. Because it is deposited by vapor deposition, Parylene provides a conformal coating on virtually any substrate which is not achievable by other means. Its lubricity is close to that of Teflon but can be applied uniformly in much thinner coatings, ideal for MEMS and BioMEMS based applications. Parylene's pinhole free conformal coating protects coated substrates from moisture, chemicals, and electric charge. While Parylene is typically used to coat circuit boards or immobilize particles, it can also be removed from the original surface and used as a microstamp allowing MEMS patterns to be transferred reproducibly to polymers with various properties.
  • Parylene properties are available from the manufacturer at
    http://www.scscookson.com/parylene/properties.htm
    http://www.scscookson.com/downloads/coatspec.pdf
  • In single-sided depositions, another set of dummy wafers must be provided to cover the backside of the wafers.
  • Parylene can be patterned in oxygen plasma with a photoresist mask. (O2 15 sccm, RF Power=100W, Bias=470-500V)