Process Hierarchy

on front
  10X G-line photolithography (Shipley SPR 220-7) Down
  2 HMDS prime
Thickness10 µm
on front
  4 Photoresist softbake
on front
  5 Stepper front-front alignment Down
on front
  6 10X stepper G-line exposure Down
on front
  8 Microscope inspection
Batch size 1
Feature geometry
Shape of feature with dimensions characterized by the minimum feature size
Field geometry
Shape of field with dimensions characterized by the maximum field size
Magnification 10
Material Shipley SPR220-7
Max field size 10 mm
Min feature size 8 µm
Resist thickness 10 µm
Wafer size
Wafer size