Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Dry oxidation
  1 Piranha Clean
  2 HF etch (10:1) Single Wafer
  3 Dry oxidation
  4 Spectrophotometric film thickness measurement
Process characteristics:
Thickness
Thickness*
must be 0 .. 0.2 µm
0 .. 0.2 µm
Material silicon dioxide
Wafer size
Wafer size