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About MEMS
Deposition: Page 6 of 17
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Evaporation
LPCVD
Low-stress SiN deposition
Miscellaneous deposition
Oxidation
PECVD
Spin casting
Sputtering
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
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Process
Dry/wet/dry oxidation
HTO on SiN on HTO LPCVD
HTO on silicon nitride
High temperature silicon dioxide (HTO) LPCVD
LTO LPCVD (both sides)
LTO LPCVD (single side)
Low-stress polysilicon LPCVD
SiN on HTO on SiN LPCVD
Silicon dioxide PECVD
Silicon nitride LPCVD
Silicon nitride PECVD
Silicon nitride on HTO
Undoped polysilicon LPCVD
Wet TCA oxidation
Wet oxidation
Aluminum Zinc Oxide (AZO) deposition
Indium Tin Oxide (ITO) deposition
Niobium Titanium Oxide (NTO) deposition
Anti-stiction coating (Alkylhalosilanes)
ALD
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