Process Hierarchy

Contact mask lithography
A mask of the pattern to be transfered is made on a glass plate. The glass mask is placed directly in contact with the substrate and a light source is used to expose the photoresist. After development, a positive or negative image is created in the photoresist. Most photoresists are positive.
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Process
Contact lithography (Image reversal)
Contact photolithography (Automated)
Contact photolithography (Manual - Negative)
Contact photolithography (Manual)
Contact photolithography (SU-8)
Contact photolithography (Spray coat)
Contact photolithography (front-front align)
Contact photolithography (front-front align) (SU-8)
Contact photolithography (front-back align) (AZ 9260)
Contact photolithography (front-back align) (Shipley 1813)
Contact photolithography (front-front align) (AZ 9260)
Contact photolithography (front-front align) (Shipley 1813)
Contact photolithography (front-front align) (Shipley 1813)
Contact photolithography (Shipley 1813)
Contact photolithography (Shipley 1827)
Contact photolithography
G-line contact photolithography (Shipley 220)
G-line contact photolithography (Shipley 3612)
Contact photolithography (AZ P4400 / AZ 1518)
Contact photolithography (Image reversal)
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