| Silicon oxy-nitride PECVD |
| Titanium DC-magnetron sputtering |
| Crystalbond 555 bonding (water based) |
| STS polymer deposition |
| Amorphous silicon LPCVD |
| Amorphous silicon LPCVD (Glass-safe) |
| Low-stress silicon nitride LPCVD ( <100 MPa) |
| Low-stress silicon nitride LPCVD ( <350 MPa) |
| Silicon nitride (stress controlled) PECVD |
| Silicon nitride LPCVD |
| Undoped polysilicon LPCVD |
| Amorphous Silicon Carbide (SiC) PECVD |
| Amorphous silicon LPCVD |
| Amorphous silicon PECVD |
| Silicon Nitride PECVD |
| TEOS PECVD |
| Electroplating |
| Al, Al.5%Cu, Cu Single Layer Sputter |
| Cr, Ti Single Layer Sputter |
| Low-stress silicon nitride PECVD |
