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About MEMS
Deposition: Page 8 of 17
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Evaporation
LPCVD
Low-stress SiN deposition
Miscellaneous deposition
Oxidation
PECVD
Spin casting
Sputtering
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
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Process
Gold E-beam evaporation
Gold electroplating
Nickel DC sputtering
Nickel electroplating (sulfamate)
Nickel electroplating (sulfumate)
Titanium DC sputtering
Titanium E-beam evaporation
Atomic Layer Deposition (ALD)
Alumina (Al2O3) Atomic Layer Deposition (ALD)
Alumina/ Zinc Oxide (Al2O3/ZnO) alloy Atomic Layer Deposition (ALD)
Hafnium dioxide (HfO2) ALD
ZnO Atomic Layer Deposition (ALD)
Aluminum DC-magnetron sputtering (high power)
Aluminum DC-magnetron sputtering (low power)
Aluminum/silicon/copper DC-magnetron sputtering (high power)
Aluminum/silicon/copper DC-magnetron sputtering (low power)
Amorphous silicon PECVD
Chromium DC-magnetron sputtering (high power)
Chromium DC-magnetron sputtering (low power)
Dry oxidation
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