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About MEMS
Deposition: Page 3 of 17
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Evaporation
LPCVD
Low-stress SiN deposition
Miscellaneous deposition
Oxidation
PECVD
Spin casting
Sputtering
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
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Process
Wet oxidation
Dry oxidation
Low Stress silicon nitride LPCVD (<300 MPa)
Silicon dioxide (TEOS) LPCVD
Stoichiometric silicon nitride LPCVD
Undoped polysilicon LPCVD
Wet oxidation
Gold Evaporation with Adhesion Layer
NanoGetter deposition and patterning
Platinum Evaporation with Adhesion Layer
Wet oxidation
Wet oxidation
Dry oxidation - Chlorinated
Dry oxidation - Standard
Low Stress silicon nitride LPCVD (200 MPa)
Sputtered Metal Film
Stoichiometric silicon nitride LPCVD
Super low stress silicon nitride LPCVD (50 MPa)
Wet oxidation
Dry oxidation (metal)
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