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About MEMS
Deposition: Page 4 of 17
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Evaporation
LPCVD
Low-stress SiN deposition
Miscellaneous deposition
Oxidation
PECVD
Spin casting
Sputtering
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
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Process
Dry oxidation (non-metal)
LTO LPCVD
Low-stress silicon nitride LPCVD ( <120 MPa)
Low-stress silicon nitride LPCVD ( <200 MPa)
PSG LPCVD
Photoresist coat (Shipley 220)
Photoresist coat (Shipley 3612)
Silicon dioxide PECVD
Silicon nitride PECVD
Stoichiometric silicon nitride LPCVD
Undoped polysilicon LPCVD
Wet oxidation (metal)
Wet oxidation (non-metal)
Backside protect (AZ P4400)
Backside protect (NR1-6000PY)
Silicon dioxide PECVD
Al/2% Si DC-magnetron sputtering
Doped poly-SiC LPCVD
Dry oxidation
Hard baked resist coat (OiR 897 10i)
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