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Advantages
Capabilities
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How to Start
About MEMS
Metrology: Page 3 of 6
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Electrical metrology
Geometric metrology
Miscellaneous metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
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Process
Wafer curvature measurement
Wafer curvature measurement (stress calculation)
Wafer curvature measurement (thermal expansion & biaxial modulus calculation)
Spreading Resistance Analysis (SRA)
EDX material analysis
SEM sample analysis
Spectrophotometric film thickness measurement
Microscope inspection
Sheet resistance measurement
Spectrophotometric film thickness measurement #1
Spectrophotometric film thickness measurement #2
Spectroscopic ellipsometry film thickness measurement
Stylus profilometer step measurement
Wafer curvature measurement
Wafer curvature measurement with stress calculation
Sheet resistivity Measurement
Spectrophotometric film thickness
Stylus Profilometer Step Measurement
Wafer scale testing
Sheet resistance measurement
Results Page:
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