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About MEMS
Deposition: Page 13 of 17
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Evaporation
LPCVD
Low-stress SiN deposition
Miscellaneous deposition
Oxidation
PECVD
Spin casting
Sputtering
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
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Process
Titanium DC-magnetron sputtering
Undoped polysilicon LPCVD
Wet oxidation (metal)
Wet oxidation (non-metal)
Electroplating
Aluminum DC magnetron sputtering
Copper DC magnetron sputtering
Dehydration & vapor prime
G-line BCB coat (BCB 4000)
G-line photoresist coat (AZ4000)
Silicon dioxide PECVD
Tantalum DC Magnetron Sputtering
Titanium DC magnetron sputtering
Aluminum Nitride AC magnetron reactive sputtering
MVD of Anti-Stiction Coating (DDMS)
MVD of Anti-stiction coating (FOTS)
Polyimide deposition and pattern
Resist bonding
Parylene C deposition
Copper DC-magnetron sputter
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