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About MEMS
Deposition: Page 5 of 17
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Evaporation
LPCVD
Low-stress SiN deposition
Miscellaneous deposition
Oxidation
PECVD
Spin casting
Sputtering
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
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Process
Low-stress silicon nitride LPCVD (<300 MPa)
Low-stress silicon nitride LPCVD (<50 MPa)
P-type polygermanium LPCVD
PSG LPCVD
Parylene C deposition
Parylene N deposition
Phosphorus-doped polysilicon LPCVD
Poly-Silicon-Germanium LPCVD
Silicon dioxide LPCVD
Silicon nitride LPCVD
Titanium DC-magnetron sputtering
Tungsten DC-magnetron sputtering
Undoped amorphous silicon LPCVD
Undoped polygermanium LPCVD
Undoped polysilicon LPCVD
Wet oxidation
Zinc oxide (ZnO) RF-magnetron sputtering
Parylene C deposition
Dry oxidation
Dry/wet/dry TCA oxidation
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