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About MEMS
Deposition: Page 12 of 17
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Evaporation
LPCVD
Low-stress SiN deposition
Miscellaneous deposition
Oxidation
PECVD
Spin casting
Sputtering
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
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Process
Silicon carbide (SiC) PECVD
Silicon dioxide PECVD
Silicon nitride PECVD
Silicon oxy-nitride PECVD
Stoichiometric silicon nitride LPCVD
Aluminum DC-magnetron sputtering
Aluminum/silicon DC-magnetron sputtering
Chromium DC sputtering
Dry oxidation (metal)
Dry oxidation (non-metal)
Gold DC sputtering
LTO LPCVD
Low-stress silicon nitride LPCVD ( <120 MPa)
Low-stress silicon nitride LPCVD ( <200 MPa)
PSG LPCVD
Platinum DC sputtering
Silicon dioxide PECVD
Silicon nitride PECVD
Stoichiometric silicon nitride LPCVD
Titanium DC sputtering
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