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About MEMS
Deposition: Page 14 of 17
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Evaporation
LPCVD
Low-stress SiN deposition
Miscellaneous deposition
Oxidation
PECVD
Spin casting
Sputtering
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
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Process
Copper electroplating
Dry oxidation
Dry/wet/dry TCA oxidation
Dry/wet/dry oxidation
E-beam evaporation
Germanium E-beam evaporation
Gold static DC-magnetron sputter
High temperature silicon dioxide (HTO) LPCVD
Iridium DC-magnetron sputter
LTO LPCVD (both sides)
LTO LPCVD (single side)
Low stress polysilicon LPCVD II (300 MPa)
Low-stress polysilicon LPCVD I (100MPa)
Nickel E-beam evaporation
Photoresist coat (495 PMMA 6 A in anisole)
Photoresist coat (950 PMMA 2 A in anisole)
Photoresist coat (950 PMMA 4 A in anisole)
Photoresist coat (950 PMMA 9 A in anisole)
Photoresist coat (automated)
Photoresist coat (manual)
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